Featur
Featur
- 0603/1608 footprint surface mount device
- Ideal D protection for high frequency, low voltage applications.
- Provid D protection with fast rponse time (<1ns) allowing equipment to p IEC 61000-4-2 tting
- Very low leakage current
- Ultra low capacitance (0.15pF maximum)
- Bi-directional
Device Marking
PolySurg™ D Supprsors are marked on the tape and reel packag, not individually. Since the product is bi-directional and symmetrical, no orientation marking is required.
Dign Consideration
The location in the circuit for the TR seri has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current ociated with an D event, it is recommended to use a “0-stub” pad dign (pad directly on the signal/data line and second pad directly on common ground).
Procsing Recommendations
The TR seri currently has a convex profile on the surface of the part. This profile is a rult of the construction of the device. They can be procsed using standard pick-and-place equipment. The placement and procsing techniqu for the devic are similar to those used for chip ristors and chip capacitors.
Environmental Specifications:
- Moisture Ristance per EIA/IS-722 Paragraph 4.4.2. This standard is based upon MIL-STD-202G Method 103B but with temperature and relative humidity at +85°C and 85% RH rpectively. Tt condition ‘A’ (240Hr) per MIL-STD-202G.
- Thermal shock: MIL-STD-202, Method 107G, -55°C to 125°C, 30 min. cycle, 10 cycl.
- Vibration: MIL-STD-202F, Method 201A,(10 to 55 to 10 Hz, 1 min. cycle, 2 hrs each in X-Y-Z).
- Chemical ristance: ASTM D-543, 4 hrs @ 40°C, 3 solutions (H2O, detergent solution, defluxer).
- Operating temperature characteristics, measurement at +25°C, +105°C and -56°C.
- Full load voltage: 14.4Vdc, 18Vdc & 24Vdc for 1000 hrs, 25°C.
- Solder leach ristance and terminal adhion: Per EIA-576.
- Solder ability: MIL-STD-202, Method 208 (95% coverage).
Soldering Recommendations
- Compatible with lead and lead-free solder reflow procs
- Peak reflow temperatur and durations:
- IR Reflow = 260°C max for 10 sec. max.
- Wave Solder = 260°C max. for 10 sec. max.
