

特征和產(chǎn)品說明:Features and Descriptions:
●標準直徑3mm封裝 Standard diameter 3mm package
●長壽命和高性 Long life and high reliability
●集成電路 I.C. compatible
●芯片材料:鋁鎵銦磷 Chip material: AlGaInP?
●低功耗 Low Power
●合ROHS,無鉛 RoHS Compliant,no lead
備注:Notes:
●尺寸均為毫米(英寸)。
All dimensions are in millimeters (inches).
● 膠體底部樹脂凸出不過1.5mm。
The maximum bulge of resin at the bottom doesn’t exceed 1.5mm .
● 尺寸公差
Tolerance is &plun;0.25





